Deatail Introduction of Mechanical Performance Testing in the Semiconductor Industry

Information on the most widely used ASTM standards within the materials testing industry

Descriptions of the most prominent lSO standards within the materials testing industry

Standards including EN, DIN, JlS, and more

Mechanical testing of polymer materials in the automotive industry is directly related to the safety of components and the reliability of the entire vehicle. UnitedTest can cover mechanical performance testing for automotive interior and exterior parts, as well as functional components, adapting to automaker standards and providing comprehensive testing solutions including tensile, impact, and fatigue tests.

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Material strength is a course that most engineering fields are required to study in university education. This interesting course is very practical and makes use of testing equipment in the materials laboratory.

Mechanical testing of industrial products and components is essential to ensure their load-bearing, fatigue resistance, and impact resistance, directly preventing production accidents and ensuring stable operation of equipment. UnitedTest can cover a full range of tests including tensile, hardness, and fatigue, complying with national and international standards, and provides customized industrial mechanical testing solutions.

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Mechanical testing in the packaging industry determines the packaging's resistance to compression, impact, and tension, directly ensuring the safety of contents during storage and transportation. UnitedTest can cover comprehensive mechanical testing for packaging, complying with ISO, ASTM Standards, and provides customized testing solutions for compression, drop, tear, and more.

Mechanical testing in the transportation industry concerns the load-bearing and fatigue resistance performance of core components such as vehicles, tracks, and containers, directly ensuring transport safety and equipment durability. UnitedTest can cover mechanical testing for all types of transportation materials, complying with national and international standards, and provides customized testing solutions including tensile, fatigue, and impact tests.

Metallurgical testing examines the properties of metallic materials to determine if a particular metal is appropriate for its intended use.

Testing of polymer materials covers mechanical, thermal, and chemical properties, verifying strength, heat resistance, composition, and ensuring product quality and compliance.

UnitedTest offer world-class testing solution in testing for polymeric materials, including elastomers, thermoplastics, composites, coatings, and structural adhesives in a variety of industries.

Testing of rubber and elastomers is used to assess the various properties and performance of materials under different conditions. This is crucial for ensuring the safety, functionality, and quality of rubber and elastomer products used in industries such as automotive, construction, consumer goods, and aerospace.

Conduct adhesive testing using various testing methods to determine their performance and characteristics in applications across multiple industries such as aerospace, automotive, construction, packaging, industrial, medical, and energy, thereby supporting application development and quality assurance.

UnitedTest supply machine and testing solution for tension, compression, fracture toughness, direct shear, triaxial and ultrasonic velocity are common concrete and rock testing applications.

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The mechanical testing of industrial components directly determines the load-bearing, fatigue resistance, and wear resistance of the parts, helping to avoid equipment failure risks. UnitedTest can cover a full range of tests including tensile, hardness, and fatigue, is compatible with ISO/ASTM/GB standards, and provides customized mechanical testing solutions for industrial components.

Mechanical testing in the glass-ceramics industry determines core properties such as flexural strength, hardness, and fracture toughness, directly helping to avoid brittleness and failure risks. UnitedTest can cover comprehensive testing for flexural strength, hardness, and fracture toughness, compatible with national and ISO/ASTM standards, and provides customized testing solutions.

Tensile test evaluates material resistance to stretching, measuring strength/elongation critical for quality control. UnitedTest offers universal tensile testers (10-600KN) compliant with ASTM/ISO standards, providing tailored solutions for metals, polymers, medical & industrial materials.

Compression test assesses material resistance to compressive loads, measuring strength/deformation critical for quality validation. UnitedTest offers compression testing machines compliant with ASTM/ISO standards, providing tailored solutions for concrete, plastics, metals and industrial components.

Flexural & Bend tests evaluate material resistance to bending forces, measuring strength, stiffness and ductility for quality assurance. UnitedTest provides flexural testing machines (3-point/4-point bend) compliant with ASTM/ISO standards, offering tailored solutions for composites, plastics, metals and construction materials.

Torsion Test evaluates material resistance to rotational forces, measuring torsional strength/ductility critical for fasteners, insulators, shafts. UnitedTest offers torsion testers compliant with ASTM A938/ISO 16047, providing tailored solutions for automotive, aerospace, fastener industries.

Fatigue Test assesses material durability under cyclic loading, critical for predicting service life of industrial components. UnitedTest offers fatigue testing systems (axial/bending/torsion) compliant with ASTM E466/ISO 12106, providing tailored solutions for automotive, aerospace and manufacturing sectors.

Peel Test measures material adhesion strength by evaluating resistance to peeling forces, critical for adhesives, films, packaging. UnitedTest offers peel testers compliant with ASTM D903/ISO 8510, covering 90°/180° peel tests, and tailored solutions for packaging, automotive, textile industries.

Impact Test evaluates material resistance to sudden shock loads, critical for assessing toughness and fracture risk. UnitedTest offers impact testers (Charpy/Izod/fall weight) compliant with ASTM E23/ISO 148, providing tailored solutions for metals, plastics, glass and industrial components.

Tear & Shear Test evaluates material resistance to tearing and shearing forces, measuring critical strength parameters for quality control. Tear tests (Elmendorf/trouser/trapezoidal) assess resistance to crack propagation in films/fabrics, while shear tests measure resistance to parallel forces in joints/bolts. UnitedTest provides universal testing machines (10KN-600KN) with specialized fixtures for both tests, compliant with ASTM D624/D3164 and ISO standards, serving automotive, packaging and construction industries.

Hardness test measures material's resistance to permanent indentation, critical for quality control. UnitedTest offers universal hardness testers (Rockwell/Brinell/Vickers) compliant with ASTM/ISO standards, plus tailored hardness testing solutions for diverse industrial needs.

Biaxial/triaxial tests evaluate material performance under multi-axis loads, critical for biomaterials, metals and composites. UnitedTest provides compliant testing machines (ASTM/ISO) for planar biaxial, static/fatigue triaxial tests, with tailored solutions for industrial & biomedical needs.

Friction and wear tests assess material resistance to friction, abrasion and wear, critical for industrial material performance validation. UnitedTest offers tribometers compliant with ASTM G99/ISO standards, covering pin-on-disk, four-ball tests, and tailored friction & wear testing solutions for diverse industries.

Pressure test evaluates material/component resistance to static/dynamic pressure, critical for sealing, strength and safety validation. UnitedTest offers pressure testing machines compliant with ASTM/ISO standards, covering burst, hold-pressure tests, and tailored solutions for industrial, automotive & medical sectors.

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Non-destructive Test (NDT) evaluates material/component integrity without damage, critical for safety & quality across industries. UnitedTest offers ultrasonic/X-ray/magnetic particle NDT equipment compliant with ASTM/ISO standards, plus tailored NDT solutions for aerospace, automotive & manufacturing sectors.

The mechanical property testing of the semiconductor industry revolves around the entire industry chain of wafer substrates, packaging materials, interconnect structures, and devices/modules, and its core features are micro-scale, high precision, multi-material collaborative adaptation, and dual verification of process/reliability. The test objects cover more than ten types of materials such as silicon/silicon carbide/gallium nitride, metal interconnect materials, polymer packaging materials, ceramic substrates, etc., and are used for material screening, process yield control, and device reliability verification.

Deatail Introduction of Mechanical Performance Testing in the Semiconductor Industry

1. Mechanical property testing of wafer/substrate materials:

The test objects are silicon wafers (mono/polycrystalline), wide bandgap semiconductor substrates (SiC, GaN, GaAs), and sapphire substrates, most of which are brittle crystals, and the core detects fracture resistance, deformation resistance, hardness and other properties to avoid chipping and warping during wafer cutting/grinding/bonding.

Testing items	Purpose of the test	Specimen information	Test equipment	Test Principle / Method	Core application scenarios
Nanohardness / Yung's modulus	Check the surface hardness and elastic modulus of the substrate to avoid surface scratches and plastic deformation during grinding/polishing	Original substrate/polished substrate, no specimen preparation, directly test the surface	Nanoindenter (Berkovich indenter)	The microload (μN-mN grade) indenter is pressed into the surface of the material, the depth-load curve is recorded, and the hardness/modulus is calculated by the Oliver-Pharr method	Substrate polishing process yield control, wide bandgap substrate (SiC) surface performance verification before epitaxy, and sapphire substrate hardness testing before dicing
Warpage / bending deformation	Detects overall wafer flatness to avoid alignment deviation during bonding/lithography	Whole wafer (4/6/8/12 inch), post-cut wafer	Laser warpage tester, 3D topography instrument, white light interferometer	The laser scans the wafer surface, collects height data, and calculates the overall warp (Warp) and local flatness (Bow)	Deformation detection after wafer grinding/thinning, interface deformation verification after wafer bonding (silicon-silicon bonding, heterogeneous bonding), and wafer flatness screening before lithography
Fracture toughness (indentation method / unilateral notched beam)	Verify the crack propagation resistance of brittle substrates to avoid wafer chipping caused by microcracks	Substrate specimens with prefabricated micro-notches (e.g., SiC: 20×10×1mm)	nanoindentation instrument, microload universal testing machine	Indentation method: the indenter is pressed to produce microcracks, and the fracture toughness is calculated by the crack length; Unilateral notched beam: Three-point bending loading notched specimens to record fracture loads	Wide bandgap substrate (SiC, GaN) preparation process, wafer laser cutting post-crack control

2. Mechanical property testing of packaging core materials

Semiconductor packaging is a multi-material composite system (metal, polymer, ceramic, glass), the core of which tests the strength, modulus, thermomechanical adaptability, and aging resistance of the material, and avoids thermal stress cracking caused by the mismatch of material mechanical properties (such as delamination caused by the difference in thermal expansion coefficient between the chip and the plastic encapsulant).

(1) Metal packaging materials (lead frame, bonding wire, solder, heat sinks)

Testing items	Purpose of the test	Specimen information	Test equipment	Core application scenarios
Microtensile strength/elongation	Verify the tensile fracture resistance of fine metal materials to avoid fracture during bonding/stamping	Bonding wire (Au/Al/Cu, diameter 18-50μm), lead frame punch sectioning (0.1-0.3mm thick)	Micro-load universal testing machine (with micro-tensile fixture), electronic stretching machine	Bonding wire selection (e.g., mechanical verification of Cu wire instead of Au wire), lead frame stamping process, solder foil performance testing
Hardness (Vickers / Knoop)	Check the hardness of the metal surface to avoid the stamping of the lead frame and the softening and deformation of the solder	Lead frame surface, solder bumps, heat sink surface	Microscopic Vickers hardness tester, Knoop hardness tester	Verification of lead frame plating process (Ni/Au plating), hardness testing of solder alloy (SnAgCu, SnPb), and surface treatment verification of heat sinks
Creep performance	Verify the slow deformation ability of solder under temperature + load to avoid solder failure after long-term operation	Solder specimen (φ1×2mm), solder bump array	High Temperature Creep Tester (Micro Load)	Power device solder interconnects (such as IGBT solder layers), solder selection for automotive semiconductor packaging, and reliability verification of high-temperature semiconductor devices
Fatigue performance (tensile compression fatigue)	Verify the failure resistance of metal materials under cyclic loads and match the dynamic working load of semiconductors	Lead frame specimens, solder specimens	Electro-hydraulic servo fatigue tester (microload class)	Reliability verification of automotive semiconductor (engine compartment) lead frame and automotive-grade chip solder layer

(2) Polymer packaging materials (plastic EMC, underfill adhesive UF, adhesive DA)

Testing items	Purpose of the test	Specimen information	Test equipment	Core application scenarios
Flexural strength	Verify the rigidity and bending resistance of the encapsulant to avoid cracking during transportation/assembly of the package	Standard splines (ISO 178:80×10×4mm), injection molded	Electronic universal testing machine (100N-10kN)	Selection of plastic encapsulation materials, verification of packaging molding process (injection pressure/temperature), and attenuation detection of plastic encapsulation materials after high temperature aging
Tensile strength / elongation at break	Verify the toughness and tensile resistance of polymer adhesives/encapsulants to avoid cracking caused by thermal stress	Standard splines (ISO 527:150×10×4mm), injection molding/curing molding	Electronic universal testing machine	Selection of underfill adhesive and viscotic adhesive, and verification of temperature and aging resistance of plastic encapsulants
Shore / Rockwell hardness	The hardness of polymer materials is tested to avoid deformation of the packaging caused by too soft plastic material and brittle cracking caused by too hardness	Standard Spline (Thickness ≥ 6mm)	Shore hardness tester (Type D), Rockwell hardness tester	Conventional performance testing of plastic encapsulation materials and verification of the curing degree of underfill adhesive
Shear strength (adhesive layer shear)	Verify the bond strength of the adhesive/underfill adhesive to avoid delamination of the chip from the substrate/pad	Chip-substrate bonding specimens (e.g. silicon wafers - PCBs / ceramic substrates)	Micro Shear Tester and Electronic Universal Tester	Selection of adhesive/underfill adhesive, yield control of packaging and placement process, and verification of bonding performance after thermal aging of devices

Deatail Introduction of Mechanical Performance Testing in the Semiconductor Industry

(3) Ceramic/glass substrates (alumina, aluminum nitride, glass ceramics)

Testing items	Purpose of the test	Specimen information	Test equipment	Core application scenarios
Flexural strength (three-point bending)	Verify the resistance of the substrate to resist fracture and avoid chipping during the patch/soldering process	Substrate Slice (20×10×0.63mm)	Electronic universal testing machine (microload class)	Power semiconductor ceramic substrate selection, substrate soldering process verification, and high-temperature substrate performance testing
Fracture toughness	Verify the crack propagation ability of the substrate to avoid micro-crack failure caused by machining	Substrate specimens with prefabricated notches	Microload universal testing machine, nanoindentator	Preparation of aluminum nitride (AlN) high thermal conductivity substrate, glass ceramic substrate dicing process

3. Testing of key mechanical connection properties in the packaging process:

The core of semiconductor packaging is the mechanical reliability of interconnect structures (such as bonding, soldering, bonding), which belongs to component-level process verification, which directly determines packaging yield and device life, and is one of the core mechanical testing links in the semiconductor industry.

Testing items	Purpose of the test	Specimen information	Test equipment
Bond strength (pull-off / shear)	Verify the bonding reliability of gold wire, aluminum wire, copper wire with chip pads and lead frames to avoid bond point detachment/breakage	Package specimens with bonding wires (e.g., chip-lead frame bonds), wafer-level bonding specimens	Wire Bond Tester, Micro Shear Tester
Solder bump / solder ball shear strength	Verify the connection strength of the solder bump (Flip Chip) and BGA/CSP solder ball to the chip/substrate to prevent the solder ball from falling off	Flip Chip specimens, BGA/CSP packages, wafer-level bump specimens	Micro shear tester BGA shear tester
Shear strength (chip shear)	Verify the adhesive adhesive strength of the chip and the substrate/lead frame to avoid chip delamination	Package specimens after bonding (chip - substrate / lead frame)	Chip shear tester, micro universal testing machine
The interlayer shear strength of the stacked encapsulation	Verify the strength of the interlayer connection of 3D IC / stacked packages to avoid delamination between layers	IC stacked specimens, POP packaging specimens	Micro Shear Tester
Wafer bond interface strength (peel/shear)	Verify the interfacial bond strength of silicon-silicon bonds, heterogeneous bonds (e.g., silicon-glass, SiC-silicon) to avoid interface delamination	Wafer bonding specimen	Electronic universal testing machine

UnitedTest Fatigue Testing Machine mainly used at a variety of material and components, parts for both dynamic and static mechanical property testing, include tension, compression, low cycling test, match with high-low temperature chamber can execute the temperature test.

WDW Series Computer Control Electronic Universal Testing Machine made by UNITEDTEST range from 100N to 600KN load capacity with various models like single columns, table type, door frame type etc., is used to perform tension, compression, flexure/bending, shearing, peeling etc., test for metal and nonmetal specimens. Matched with UNITEDTEST design and produced various test fixture, like peel, flexure, puncture, tear, pneumatic grip, belt tension etc., this UTM can be used to almost all materials include but not limited to steel rod, rubber, steel wire, plastic, seat belt, textile, wood, panel etc., mechanical performance inspection.

The main components of a precision micro tensile testing machine include the loading system, measurement system, control system, and data processing system. The loading system is responsible for applying tensile force, usually through a motor-driven screw or pneumatic device, ensuring that the force is applied evenly and controllably.

Three-point bending test fixture for fiber-reinforced plastic composites, designed in accordance with ISO 14125, provides a standardized method for determining the flexural properties of composite materials using a three-point bending test.

Rail Shear Test fixture are described as Method B in ASTM Standard D4255, mainly used to measure the polymer mechanical strength.

The hardness of polymer materials is tested to avoid deformation of the packaging caused by too soft plastic material and brittle cracking caused by too hardness.

Semiconductor mechanical testing needs to follow industry-specific standards, the core is divided into international general standards and subdivision field standards, and some of the basic standards for testing and multiplexing material mechanics, the core standards are as follows:

1. JEDEC standards: general reliability standards for semiconductor devices (e.g., JESD22-A104 (temperature cycling), JESD22-A107 (mechanical shock), JESD22-B117 (vibration));

2. AEC-Q100/101 standard: automotive-grade semiconductor device reliability standard (including mechanical and thermomechanical reliability testing);

3. IPC standards: Semiconductor packaging process inspection standards (e.g., IPC-9701 (solder performance), IPC-SM-785 (wire bond strength));

4. ISO/IEC standards: basic standards for material mechanics (e.g. ISO 178 (bending), ISO 527 (tensile), ISO 14577 (nanoindentation));

5. ASTM Standards: Microscale mechanical testing standards (e.g., ASTM E2546 (nanoindentation), ASTM E1820 (fracture toughness));

6. GB/T standards: domestic semiconductor testing standards (such as GB/T 40230 (mechanical reliability of semiconductor devices), GB/T 30644).

Deatail Introduction of Mechanical Performance Testing in the Semiconductor Industry

Key points of core testing equipment selection:

The core differences between mechanical testing equipment in the semiconductor industry and traditional material mechanical equipment are micro-load, high precision, micron-level positioning, and non-destructive testing.

1. Load range: mainly micro-load stage (μN-mN stage for nanoindentation/MEMS, N stage for wafer/packaging materials, kN stage for module-level vibration/shock);

2. Positioning accuracy: micron / sub-micron (especially bonding/solder shearing, MEMS microstructure detection);

3. Environmental adaptation: support high and low temperature/vacuum (such as high temperature bending, thermal creep, vacuum bond strength testing);

4. Automation: Support batch testing (such as wafer-level bump shearing, bond strength batch testing), adapted to semiconductor mass production processes;

5. Non-destructive: Prefer non-destructive testing equipment such as 3D topography and ultrasonic scanning (C-SAM) to avoid detecting damaged devices.

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